WIDEPIX 3D

Description:

WidePIX 3D was designed with special emphasis to particle tracking which is often required in a scientific experimental work. Four versatile WidePIX 3D modules are assembled compactly and synchronised providing 3D particle tracking capability. Very compact and tight design enables very broad field-of-view of 164° while small pixels assure precise direction determination.

In WidePIX 3D, each layer consists of 300 µm thick silicon sensor flip chip bonded to Timepix readout chip with thickness reduced to 100 µm. The distance between two sensors in subsequent layers is 250 µm only (i.e. less than single sensor thickness).

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  • Specification
    Model WIDEPIX 3D

    Sensor Material:

    Si

    Sensor Thickness:

    300 μm, 500 μm and 675 μm

    Sensitive Area:

    14 mm x 14 mm

    Number of Layers:

    up to 4 layers

    Number of pixels in layer:

    256 x 256

    Pixel Pitch:

    55 μm

    Resolution:

    9 lp/mm

    Readout Speed:

    50 frames/s

    Photon Counting Speed:

    Up to 3 x 106 photons/s/pixel

    Threshold Step Resolution:

    0.1 keV

    Energy Resolution:

    0.8 keV (THL) and 2 keV (ToT)

    Readout Chip:

    Timepix

    Pixel Mode of Operation:

    Counting, Time-over-Threshold, Time-of -Arrival

    Connectivity:

    USB 2.0

    Dimensions:

    175 mm x 65 mm x 20 mm

    Weight:

    350 g

    Software:

    Pixet Pro